Component-mounting FPC
Features
 □ Excellent flexibility and allowing secondary processing,
including bending, and the mounting of electronic
components.
Basic structure
|
|
|
|
|
|
|
|
Material |
Thickness |
|
|
| 1 |
SR layer |
- |
20 μm |
|
| 2 |
Conductor layer |
Copper foil |
12 μm, 18 μm |
|
| 3 |
Insulating layer |
Liquid crystal polymer |
25 μm, 50 μm |
|
| 4 |
Interlayer connection |
Silver paste |
- |
|
| 5 |
Adhesive layer |
Epoxy |
15 μm, 25 μm |
|
| 6 |
Coverlay |
Polyimide |
12.5 μm, 25 μm |
|
| 7 |
Adhesive layer |
Epoxy |
30 μm, 40 μm |
|
| 8 |
Reinforcing plate layer |
Glass epoxy |
(1.0 mm, 1.6 mm) |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|