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Test Sockets Use List │ Products & Services │ YAMAICHI ELECTRONICS

ホーム > English Top > Products & Services > Test & Burn-in Sockets > Test Sockets Use List
Probe Card

Use List

Offering optimal solutions for diversified packages and test specifications with our design and production know-how cultivated with test burn-in sockets.

1-5（Total 5 Count）

カートリッジ式テストソケット　T3P

Cartridge-type test socket with spring probe pins, T3P

Sockets supporting BGA/LGA packages.
Short delivery lead-time is achieved by utilizing standard probe pins and injection molded insulators.
Easy maintenance by using mold cartridge contact block.
Socket is designed with standard outline for manual test and handler test applications.
For details, please contact Yamaichi representative.

カスタム仕様ソケット

Custom-made socket

Using spring probe pins for various packages, such as BGA, LGA, QFP, SOP, QFN, and SON. Socket can be customized and developed according to customer requirement.
Supporting Kelvin contact, image sensor and PoP applications that require contact at top and bottom sides of IC package.
For details, please contact Yamaichi representative.

非磁性ソケット

Non-magnetic socket

Designed with non-magnetic components including spring probe pins for sensor device tests.
Supporting up to 0.4-mm pitch application.
For details, please contact Yamaichi representative.

高周波測定用スプリングプローブソケット

Socket with spring probe pins for high frequency measurement

Surface-mount socket for high frequency applications.
Y-shaped contact pins to support QFP and SOP.
Z-shaped contact pins to support QFN and SON. 
For details, please contact Yamaichi representative.

高周波測定用Y-シェイプ、Z-シェイプコンタクトソケット

Socket with Y-shape/ Z-shape contact for high frequency measurement

Surface-mount socket for high frequency applications.
Y-shaped contact pins to support QFP and SOP.
Z-shaped contact pins to support QFN and SON. 
For details, please contact Yamaichi representative.

　
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Burn-in Sockets
Test Sockets
Probe Card